One or more APV chips are mounted on a hybrid together with decoupling capacitors and termination
resistors. Since the chips are glued and bonded, the APV footing has to match the chip version.
Two different APV25 hybrids were developed at HEPHY. Fig. shows the
APV25S0 hybrid for up to four chips, while the other hybrid (fig.
, p.
)
was specifically designed for the APV25S1 irradiation test.
The schematic diagram of the repeater is shown in fig.
The bus of the APV hybrid is buffered with an extender and the levels are
adapted to those of the APV supply. Four fast amplifiers deliver the analog output of the
APVs to the VME-ADC. Once, a silicon detector module with eight APV6 chips was read out
using the analog stage of a second repeater in parallel.
Since the power supply voltages, the output stages and other details differ between APV6 and APV25 versions two different repeater boards were developed for their readout.